Assembly Lines: Adhesives Can Replace Eutectic Solder

The National Center for Manufacturing Sciences has published the results of its 6-year project that evaluated electrically conductive adhesives.

ANN ARBOR, MI—The National Center for Manufacturing Sciences (NCMS) has published the results of its 6-year project that evaluated electrically conductive adhesives as a substitute for eutectic solder for surface mount electronics assembly. The project resulted in the formulation of a new flexible conductive epoxy to address the deficiencies in impact strength and resistance stability encountered with commercial materials.

The project included a survey and evaluation of adhesives. The result is a set of minimum performance requirements for surface mount solder replacement. By working with certain adhesives, process parameters were defined, and performance limits based on accelerated environmental testing were identified. Cost analyses of adhesives and solder were also done.

To order a copy of the results, contact Cindi Bousley at 734-995-3075, visit www.ncms.org or e-mail cindib@ncms.org.

The ASSEMBLY Show South

ASSEMBLY is thrilled to return to the Music City Center in Nashville, TN for The ASSEMBLY Show SOUTH on May 1-2, 2024. This is a booming time for manufacturing and the U.S. South is right in the heart of the action. According to ASSEMBLY’s most recent annual capital spending survey, the South is projected to account for 31 percent of total spending this year, marking the fifth straight year this region has accounted for at least 30 percent of capital spending in the U.S.

In this session, manufacturers will learn how Quality function deployment (QFD) can transform consumers’ qualitative demands into quantitative parameters that will shape the design of their product and, ultimately, their manufacturing process.

Sponsored by: