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The research is being funded by a 3-year grant from the Lower Saxonian Ministry for Economics, Technology and Traffic. The goal of the project is to develop a modular, compact system that can inspect devices at an oblique angle. Such a system would be able to inspect hidden solder connections in the third dimension. The researchers then hope to use inspection data to provide feedback into the production process.
For more information on X-ray inspection equipment, call FeinFocus at 203-969-2161 or visit www.feinfocus.com.