Amkor Technology Inc. needed a multichip die bonder to assemble large flip chip devices for semiconductor manufacturers. It selected Datacon North America Inc.’s 2200 apm + multichip die bonder.
Given Imaging contracted Scapa Medical to devise a way for reusable antennas to be placed onto the patient's skin and then be removed after 8 hours, without damaging the antenna or hurting the patient.
From building straightforward tables and workstations to frames for automated assembly systems, many assemblers are turning to modular profile systems.