The increasing use of lead-free solder has renewed interest in the vapor phase reflow process.
Invented in 1973, vapor phase reflow is as old as surface mount assembly itself. Despite some distinct advantages over infrared and convection reflow, those processes gradually supplanted vapor phase as the soldering methods of choice, especially for high-volume applications. Vapor phase reflow was primarily relegated to prototyping jobs and to small runs of highly complex, highly critical boards.