ANN ARBOR, MI—The National Center for Manufacturing Sciences (NCMS) has published the results of its 6-year project that evaluated electrically conductive adhesives as a substitute for eutectic solder for surface mount electronics assembly. The project resulted in the formulation of a new flexible conductive epoxy to address the deficiencies in impact strength and resistance stability encountered with commercial materials.
The project included a survey and evaluation of adhesives. The result is a set of minimum performance requirements for surface mount solder replacement. By working with certain adhesives, process parameters were defined, and performance limits based on accelerated environmental testing were identified. Cost analyses of adhesives and solder were also done.
To order a copy of the results, contact Cindi Bousley at 734-995-3075, visit www.ncms.org or e-mail email@example.com.