Depaneling machines separate circuit boards by bending, pinching, punching, routing, sawing or shearing.

Several technologies are available for "depaneling" circuit boards. Depaneling machines can be manual, semiautomatic or fully automatic. They separate boards, singly or en masse, by bending, pinching, punching, routing, sawing or shearing. Which technology to use depends on production volume and variety, on the design of the board and its components, and on how the boards are connected.