Assembly in Action: Multichip Bonder Assembles Flip Chips
Amkor Technology Inc. needed a multichip die bonder to assemble large flip chip devices for semiconductor manufacturers. It selected Datacon North America Inc.’s 2200 apm + multichip die bonder.
Amkor Technology Inc. (West Chester, PA) is a provider of contract semiconductor assembly and test services. It offers semiconductor companies and original equipment manufacturers a complete set of microelectronic design and manufacturing services.