Flip chip technology has emerged as the best way to manufacture system in package applications. Flip chips are an advanced form of surface mount technology in which bare semiconductor chips are turned upside down and bonded directly to a printed circuit board or chip carrier substrate.
The chip can be made of silicon, gallium-arsenide, indium-phosphide or silicon-germanium. The substrates could be ceramic, epoxy-glass laminate, polymer thin-film, resin-coated copper, glass, silicon, dielectric-coated metal, liquid crystal polymer, metal matrix composite, low-temperature co-fired ceramic, ceramic thick-film and multilayer high temperature co-fired ceramic.