IPC and HKPCA Form Exhibition for PCB and Assembly Industries
NORTHBROOK, IL—IPC-Association Connecting Electronics Industries and the Hong Kong Printed Circuit Association (HKPCA) will coproduce the International Printed Circuit and Electronics Assembly Fair on Sept. 17 to 19, 2003, at the Guangzhou International Convention Center in Guangzhou, China. The event will serve the printed circuit board (PCB) and electronics assembly industries.
"We are very excited about this joint venture, which will undoubtedly leverage the experience, memberships and synergies of our two associations," says Stan Plzak, IPC chairman of the board and SMTC Corp. executive vice president. "The timing is right for an event of this magnitude, and the location is prime. This fair will create a venue for exhibitors to better reach the fastest growing electronics market in the world."