IPC Study: Semiconductor Supply Chain is Vulnerable Without Federal Investment
BANNOCKBURN, IL—A new IPC study says congressional action is urgently needed to strengthen the health of the domestic advanced packaging industry if it is to meet increased demand in chip production. IPC says its study is a thorough, data-driven analysis of the global semiconductor and advanced packaging ecosystem that highlights the role of advanced packaging in driving innovation in semiconductor designs.
According to the report, congressional appropriations of more than $50 billion is needed to support U.S. semiconductor manufacturing. In addition, increasing silicon production without bolstering domestic advanced packaging capabilities is likely to lengthen the semiconductor supply chain, as chips will still have to be sent abroad for packaging and assembly into finished products.