Scientist and Application Engineer
Brian Chislea is a Technical Service and Development Scientist with Dow Corning. He has been with the company since 2004. His specialty is developing silicone materials for conformal coating and encapsulating electronics. Prior to joining Dow, he was an engineer's assistant at automotive supplier Delphi Technologies.
He has a bachelor's degree in electrical and electronics engineering from Saginaw Valley State University in University Center, MI.