Assembly Lines: Adhesives Can Replace Eutectic Solder
The National Center for Manufacturing Sciences has published the results of its 6-year project that evaluated electrically conductive adhesives.
ANN ARBOR, MI—The National Center for Manufacturing Sciences (NCMS) has published the results of its 6-year project that evaluated electrically conductive adhesives as a substitute for eutectic solder for surface mount electronics assembly. The project resulted in the formulation of a new flexible conductive epoxy to address the deficiencies in impact strength and resistance stability encountered with commercial materials.