Assembly in Action: Motion Package Cuts Cost, Minimizes Footprint
The low-profile leadscrew and rail minimized the footprint of the automated bonder. To further reduce the cost and improve the reliability of the machine, the company adopted a fully assembled motion control module in place of individual components.
The bonder's four-axis rotary head attaches aluminum wire leads to electronic devices for interconnects. When semiconductor manufacturers expressed interest in a high-volume production machine, engineers looked for a space-saving mechanism to feed leadframe magazines. "Floor space in electronics assembly areas is expensive," explains Bob Babayan, vice president of engineering. "There's a lot of emphasis on achieving a small footprint for assembly machines."