Capacitors, switches, transducers, temperature sensors—and even complete circuits—often need potting. Here’s an overview of potting materials, and the manual and automated potting methods commonly used in assembly.
The most common method of potting involves testing the device and placing it in a pot, case or shell. After the device is mounted in the case, the potting compound is poured inside, completely covering the device and encasing it. The case becomes part of the finished unit.