Thermal Interface Material Fills Gaps
Bergquist Gap Filler TGF is a thermal interface material (TIM) that can be reworked without sacrifices in thermal conductivity or automation performance. It is a one-part, cure-in-place liquid gap filler for use with automated dispensing equipment in high-volume manufacturing operations. It is ideal for miniaturized, high-density assemblies and complex architectures, penetrating small gaps for complete coverage. Once cured, the material provides optimized surface contact and thermal transfer with a 1.5 kelvin rating thermal conductivity. It also delivers excellent low and high temperature mechanical and chemical stability. The TIM can be peeled away cleanly from contact surfaces to safeguard delicate componentry and preserve product value.