Hentec/RPS Expands Assembly Capacity, Publishes Tech Paper on Selective Soldering
NEWMAN LAKE, WA—Hentec Industries/RPS Automation, a manufacturer of selective soldering and test equipment for electronics, has expanded its assembly and production workforce, and published an 8-page technical paper entitled “Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components.”
“As our business continues to grow, we have added new employees and created new positions within our organization,” says Reid Henry, president of Hentec/RPS. “Our automated selective soldering machines, component lead tinning machines and solderability test equipment are [still] made in the USA, which has minimized the effect of the past year’s trade war. In addition, the continued need for gold removal, component reconditioning and BGA deballing continues to increase demand for our Odyssey robotic hot solder dip machines.”