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Home » Store » Books » Contamination of Electronic Assemblies
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Contamination of Electronic Assemblies

$275.00
Books
No Comments
November 2002
9780367395667
232

Product Details

Features

 

  • Lists sources of contamination throughout the manufacturing process
  • Illustrates quality and reliability issues with photos and tables
  • Discusses aspects of contamination from the manufacture of the glass fibers used in the laminates to the complete assembly of the finished product
  • Targets defects encountered during the manufacturing process along with the contaminants causing those defects
  • Discusses how defects can be reduced through detection and control methods

     

    Summary

    Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has become necessary for improving quality and reliability and reducing costs of electronic assemblies. Designed as a practical guide, Contamination of Electronic Assemblies presents a generalized overview of contamination problems and serves as a problem-solving reference point. It takes a step-by-step approach to identifying contaminants and their effects on electronic products at each level of manufacture.

    The text is divided into four sections: Laminate Manufacturing, Substrate Fabrication, Printed Wiring Board Assembly, and Conformal Coatings. These sections discuss all aspects of contamination of electronic assemblies, from the manufacture of glass fibers used in the laminates to the complete assembly of the finished product. The authors present detection and control methods that can help you reduce defects during the manufacturing process. With tables, figures, and fishbone diagrams serving as a quick reference, Contamination of Electronic Assemblies will help you familiarize yourself with the origination, detection, measurement, control, and prevention of contamination in electronic assemblies.

  • Table of Contents

    Preface
    Introduction

    PART 1 - LAMINATE MANUFACTURING

    Chapter 1 Contaminant Sources in Laminates
    1.1 Glass Fibers
    1.2 Fiber Treatment Agents
    1.3 Epoxy Resin
    1.4 Copper Cladding
    1.5 Volatile Matter
    1.6 Summary of Contaminants

    Chapter 2 Measuring Contaminants in Laminates

    Chapter 3 Quality and Reliability of Laminates
    3.1 Weave Exposure and Weave Texture
    3.2 Pits and Microvoids
    3.3 Measling and Crazing
    3.4 Blistering and Delamination
    3.5 Foreign Inclusions
    3.6 Hollow Fibers
    3.7 Conductive Filament Formation
    3.8 Resin Reversion

    Chapter 4 Control Methods in Laminate Manufacturing
    4.1 Manufacturing Process Assessment
    4.1.1 Quality Assurance Through Certification
    4.1.2 Statistical Process Control
    4.1.3 Optimization
    4.1.4 Cleaning
    4.1.5 Best Practices
    4.2 Control Monitoring Through Testing
    4.2.1 Visual Inspection
    4.2.2 Glass Transition Temperature Testing
    4.2.3 Flame Retardant Content Measurement
    4.2.4 Prepreg Resin Content Measurement
    4.2.5 Copper Foil Surface Inspection
    4.3 Root Cause Analysis
    4.3.1 Material Traceability
    4.3.2 Corrective and Preventive Actions
    4.3.3 Documentation
    4.4 Supply Chain Assessment
    4.4.1 Vendor Assessment
    4.4.1.1 Consumables Applied during Manufacturing
    4.4.2 Shipping, Handling, and Storage

    PART 2 - SUBSTRATE FABRICATION

    Chapter 5 Contaminant Sources in Substrates
    5.1 Plant Air and Machinery
    5.2 Abrasive Brushing
    5.3 Chemical Pre-treatment
    5.4 Imaging
    5.5 Electroplating
    5.6 Electroless and Immersion Plating
    5.7 Etching
    5.8 Tinning and Fusing Operations
    5.9 Solder Masking
    5.10 Drying
    5.11 Handling and Packaging
    5.12 Summary of Contaminants

    Chapter 6 Measuring Contaminants in Substrates

    Chapter 7 Quality and Reliability of Substrates
    7.1 Nonwetting and Dewetting
    7.2 Plating Voids
    7.3 Haloing
    7.4 Lifted Lands
    7.5 Resist Deadhesion
    7.6 Resist Blistering and Waving
    7.7 Vesication
    7.8 Soda Strawing
    7.9 Blistering
    7.10 Delamination
    7.11 Particle Contamination

    Chapter 8 Control Methods in Substrate Manufacturing
    8.1 Manufacturing Process Assessment
    8.1.1 Quality Assurance Through Certification
    8.1.2 Statistical Process Control
    8.1.3 Cleaning
    8.1.4 Best Practices
    8.2 Control Monitoring through Testing
    8.2.1 Visual Inspection
    8.2.2 Automated Optical Inspection
    8.2.3 Plated Through Hole Reliability Test
    8.2.4 Insulation Reliability Testing
    8.2.5 Electrical Continuity Testing
    8.3 Physics of Failure Based Root Cause Analysis
    8.3.1 Material Traceability
    8.3.2 Corrective and Preventive Actions
    8.3.3 Documentation
    8.4 Supply Chain Assessment
    8.5 Shipping, Handling, and Storage

    PART 3 - PRINTED WIRING BOARD ASSEMBLY

    Chapter 9 Contamination Sources in Printed Wiring Assemblies
    9.1 Receiving and Handling
    9.1.1 Fingerprints
    9.1.2 Gloves
    9.1.3 Food, Drink, and Tobacco
    9.1.4 Airborne Particles
    9.1.5 Tools
    9.1.6 Fault Markers
    9.2 Storage
    9.3 Components
    9.4 Assembly
    9.4.1 Temporary Masking
    9.4.2 Component Mounting
    9.4.3 Fluxing
    9.4.3.1 Rosin
    9.4.3.2 Water-Soluble
    9.4.3.3 Synthetic Activated
    9.4.3.4 Low Solids
    9.4.4 Soldering
    9.4.4.1 Blowholes
    9.4.5 Cleaning
    9.4.6 Conformal Coating
    9.4.7 Testing
    9.4.8 Repair and Rework
    9.5 Use Conditions

    Chapter 10 Measuring Contaminants in Printed Wiring Assemblies
    10.1 Testing for Ionics
    10.1.1 Ionic Contamination Test
    10.1.2 Ion Chromatography
    10.1.3 Omega Meter and Ionograph
    10.2 Testing for Nonionics
    10.2.1 High-performance Liquid Chromatography
    10.2.2 Ultraviolet/Visible Spectrophotometry
    10.2.3 Coulometry
    10.2.4 Turbidimetry
    10.3 Surface Insulation Resistance Test
    10.4 Electromigration Test

    Chapter 11 Quality and Reliability of Printed Wiring Assemblies
    11.1 Flux Residues
    11.2 Particulate Matter
    11.3 White Residues
    11.4 Corrosion
    11.5 Solder Voids
    11.6 Coating Deadhesion
    11.7 Black Pad

    Chapter 12 Contamination Removal
    12.1 Abrasive Cleaning
    12.2 Solvent Cleaning
    12.2.1 Alcohols
    12.2.1.1 Methyl Alcohol
    12.2.1.2 Ethyl Alcohol
    12.2.1.3 Isopropyl Alcohol
    12.2.2 Ketones
    12.2.3 Hydrocarbons
    12.2.4 Terpenes
    12.2.5 Halogenated Solvents
    12.2.5.1 Chlorinated
    12.2.5.2 Fluorinated
    12.2.5.3 Decomposition
    12.2.6 Solvent Cleaning Equipment
    12.2.7 Safety and Environmental Concerns
    12.2.8 Solvent Alternatives
    12.3 Aqueous Cleaning
    12.3.1 Water
    12.3.2 Neutralizers and Rinse Aids
    12.3.3 Saponifiers
    12.3.4 Defoamers
    12.3.5 Surfactants
    12.3.6 Equipment
    12.4 Semiaqueous Cleaning
    12.5 Emulsion Cleaning
    12.6 Ultrasonic Cleaning
    12.7 Plasma Cleaning
    12.8 Selecting a Cleaning Method
    12.9 Drying
    12.9.1 Heat
    12.9.2 Vacuum
    12.10 No Clean

    PART 4 - CONFORMAL COATINGS

    Chapter 13 Conformal Coatings
    13.1 Types of Conformal Coatings
    13.1.1 Urethanes (UR)
    13.1.2 Silicone (SR)
    13.1.3 Acrylic (AR)
    13.1.4 Epoxy (ER)
    13.1.5 Parylene (XY)
    13.1.6 Material Properties
    13.2 Application Techniques
    13.2.1 Brush
    13.2.2 Dip
    13.2.3 Spray
    13.2.4 Wave
    13.2.5 Vacuum Deposition
    13.2.6 Needle Based Selective Dispensing Systems
    13.2.7 Summary of Application Techniques
    13.3 Curing Methods
    13.3.1 Ultraviolet
    13.3.2 Two-component
    13.3.3 Thermal
    13.3.4 Moisture
    13.4 Coating Removal
    13.4.1 Chemical
    13.4.2 Mechanical
    13.4.3 Abrasive
    13.4.4 Thermal
    13.4.5 Laser
    13.4.6 Plasma Etching
    13.5 Reliability of Conformal Coatings
    13.6 Environmental Concerns
    13.7 Selection Trade-Offs

    Glossary
    References
    Index

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