Assembly in Action: Multichip Bonder Assembles Flip Chips
Amkor Technology Inc. (West Chester, PA) is a provider of contract semiconductor assembly and test services. It offers semiconductor companies and original equipment manufacturers a complete set of microelectronic design and manufacturing services.
The company needed a multichip die bonder to assemble large flip chip devices for semiconductor manufacturers. It also needed to support development and production for other applications involving 300-millimeter wafers.
Amkor evaluated several companies. The company selected Datacon North America Inc.’s (Trevose, PA) 2200 apm + multichip die bonder. “We see our customers’ requirements continually growing for larger flip chip die, and we were impressed with the capability of the 2200 apm + to pick, flip, dip, align and place die up to 50 millimeters,” says Richard Groover, vice president for flip chip technology at Amkor.
Amkor already has a large installed base of Datacon machines to assemble flip chips and multichip modules. The 2200 apm + is fully compatible with Amkor’s existing equipment for 200-millimeter wafers.
For more information on multichip die bonders, call 215-245-3050 or visit www.datacon.at.