VISTA, CA—Palomar Technologies is hosting a series of seminars throughout Asia on the latest technologies and equipment for automated component assembly. The seminars explain emerging technologies for automating component assembly with an emphasis on improving yield and lowering costs while dealing with thermal management, reduced component size and the need for increased electrical performance. The seminars cover new technologies for lead-free flip chip attachment using gold bumps and thermocompression bonding, designing microelectromechanical systems for automation, precision test and measurement equipment, and how to take products from prototype to full production. Additionally, the seminars feature live demonstrations of a production-grade alignment engine capable of 0.025-decibel repeatability. To find out about future seminars, e-mail email@example.com.