Thales, Radiall, and Foxconn Enter Preliminary Talks on Semiconductor Production in France
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Employees working at the Security Operation Centre (SOC). Photo courtesy of Thales
Thales, Radiall, and Foxconn have initiated preliminary discussions to explore potentially creating an outsourced semiconductor assembly and test (OSAT) facility in France.
The proposed facility would aim to produce more than 100 million System-in-Package (SiP) units annually by 2031, targeting advanced packaging needs in the European aerospace, automotive, telecom, and defense sectors.
The initiative anticipates bringing together additional European industry players to support an investment exceeding €250 million to strengthen European leadership in semiconductor manufacturing.
About Thales
Thales is a global leader in advanced technologies across Defense, Aerospace, and Cyber & Digital sectors. The company addresses key global challenges—sovereignty, security, sustainability, and inclusion—through an extensive portfolio of innovative products and services.
Thales invests over €4 billion annually in R&D, focusing on critical areas such as artificial intelligence, cybersecurity, quantum technologies, and cloud infrastructure. The Group operates in 68 countries with more than 83,000 employees and reported €20.6 billion in sales in 2024.
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