This website requires certain cookies to work and uses other cookies to help you have the best experience. By visiting this website, certain cookies have already been set, which you may delete and block. By closing this message or continuing to use our site, you agree to the use of cookies. Visit our updated privacy and cookie policy to learn more.
This Website Uses Cookies By closing this message or continuing to use our site, you agree to our cookie policy. Learn MoreThis website requires certain cookies to work and uses other cookies to help you have the best experience. By visiting this website, certain cookies have already been set, which you may delete and block. By closing this message or continuing to use our site, you agree to the use of cookies. Visit our updated privacy and cookie policy to learn more.
Wearable electronics initially trickled into the market with Dick Tracy-inspired watches and healthcare bracelets. They quickly gained momentum, however, and it wasn’t long before the wearables market exploded.
Assembling a printed circuit board (PCB) assembly populated with ball-grid array (BGA) packages requires the utmost precision, especially in the case of micro-BGAs.
New technologies demand well organized design-for-assembly procedures. In addition, there are different considerations for prototype assembly and production assembly, with each requiring a specific design skill set and equipment.