The 6500 is a die bonder that precisely picks, places and attaches tiny and fragile electronic and photonic components and assembles complex devices, such as telecom source lasers, RF-MEMS switches and high-performance consumer products.

The MIP awards honor vision, hard work and perseverance that transform ideas and technologies into products. Winners were selected based on their ability to demonstrate the technology's innovation, technological advancement and its potential for commercial success. Six winners were chosen from 19 finalists.