NORTHBROOK, IL—IPC-Association Connecting Electronics Industries and the Hong Kong Printed Circuit Association (HKPCA) will coproduce the International Printed Circuit and Electronics Assembly Fair on Sept. 17 to 19, 2003, at the Guangzhou International Convention Center in Guangzhou, China. The event will serve the printed circuit board (PCB) and electronics assembly industries.

"We are very excited about this joint venture, which will undoubtedly leverage the experience, memberships and synergies of our two associations," says Stan Plzak, IPC chairman of the board and SMTC Corp. executive vice president. "The timing is right for an event of this magnitude, and the location is prime. This fair will create a venue for exhibitors to better reach the fastest growing electronics market in the world."

"The International Printed Circuit and Electronics Assembly Fair is an example of how two organizations, although thousands of miles apart, can work together to benefit the industry," adds Tom Tang, chairman of the executive committee of HKPCA. "Without a doubt, this event will support the PCB and electronics assembly industries, and our respective members by producing an exhibition that attracts a quality attendee."

Both organizations plan to collect speakers for a technical conference. The conference schedule will include both half- and full-day educational courses. The conference will cover board design, electronics assembly and testing.

For more information, call Joe Dudeck at 847-790-5371 or e-mail, or call Hervy Chow at 852-2155-5099 or e-mail