Mānoa, HI—Research from the University of Hawaiʻi at Mānoa’s College of Engineering could lead to stronger, longer-lasting soft medical devices, wearable tech, and robotics. Assistant Professor Te Faye Yap and her team have developed a method to predict and control the bonding strength of silicone elastomers, materials that are valued for their flexibility and compatibility with human tissue but are often prone to weak joints.

Published in Science Advances, the study shows how curing time and temperature directly affect how well silicone layers bond. By pinpointing the optimal bonding window, manufacturers can now prevent premature peeling or failure in soft devices. The method successfully improved soft robotic parts’ flexibility by 50% and doubled the bonding strength of 3D-printed components.