Nickel Barrier Slows Rate of Intermetallic Formation

August 1, 2012

ST. PETERSBURG, FL—A thin nickel barrier will slow the rate of intermetallic growth between the base metal and surface plating on component leads. MORE

Traceability is documenting every step of production in order to enhance quality, proactively manage recalls, and provide process visibility. The challenge is determining which technology should be used in the application — RFID, barcode, or both? We will discuss each method and help determine when to use one over the other.

Nickel Barrier Slows Rate of Intermetallic Formation

Assembly Magazine

2019 October

Nickel Barrier Slows Rate of Intermetallic Formation

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