NEWMAN LAKE, WA—Hentec Industries/RPS Automation, a manufacturer of selective soldering and test equipment for electronics, has expanded its assembly and production workforce, and published an 8-page technical paper entitled “Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components.”

“As our business continues to grow, we have added new employees and created new positions within our organization,” says Reid Henry, president of Hentec/RPS.  “Our automated selective soldering machines, component lead tinning machines and solderability test equipment are [still] made in the USA, which has minimized the effect of the past year’s trade war.  In addition, the continued need for gold removal, component reconditioning and BGA deballing continues to increase demand for our Odyssey robotic hot solder dip machines.”

As for the technical paper, it provides critically important information about the selective soldering process for circuit board assembly. Topics covered include flux selection guidelines, process control essentials, PCB design considerations, and processing of thermal demanding components.  The advantages of gold removal, mitigation of gold embrittlement and solderability testing as part of a component re-tinning operation are covered as well, including testing methods and test standards.

Hentec Industries/RPS Automation has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 1990s.