New applications such as AI, 5G, IoT, ADAS, AR/VR and others are opening multiple growth opportunities for the semiconductor industry. The adoption of these technologies is generating demand for increased performance. Industry is exploiting the power advantages of lower-node technology and advanced packaging (AP) to accommodate increased functionality on a single small form factor – making production processes even more challenging. These advances in semiconductor technology and device complexity are stepping up the pressure on monitoring and controlling for semiconductor packaging processes. Process optimization is a prerequisite for high reliability, which is achieved by selecting appropriate materials and controlling critical process parameters. Optical and displacement sensors together with electrical testing are currently the most widespread methods used for chip testing and monitoring/ control of packaging processes.

However, improved methods for process monitoring and failure identification are needed in order to maintain or improve the quality and yield of a packaging process. Force, as a physical quantity causing a device failure, may not be accessible to conventional measuring methods, but it plays an equally important part in controlling and monitoring production processes such as bonding, pick-and-place, and encapsulation. Thanks to piezo dynamic force measurement technology, forces can be monitored and controlled with high resolution.