“TI is building dependable, low-cost 300-millimeter capacity at scale to deliver the analog and embedded processing chips that are vital for nearly every type of electronic system,” said Haviv Ilan, president and CEO of Texas Instruments. “Leading U.S. companies such as Apple, Ford, Medtronic, NVIDIA and SpaceX rely on TI’s world-class technology and manufacturing expertise, and we are honored to work alongside them and the U.S. government to unleash what’s next in American innovation.”

The investment includes building and ramping seven, large-scale, connected fabs. Combined, the facilities will manufacture hundreds of millions of chips daily.

Specifically, the investment will fund the following facilities:

• SM1, TI’s first new fab in Sherman, TX, will begin initial production this year, just three years after breaking ground. Construction is also complete on the exterior shell of SM2, TI’s second new fab in Sherman. Incremental investment plans include two additional fabs, SM3 and SM4, to support future demand.
• TI’s second fab in Richardson, TX, RFAB2, continues to ramp to full production and builds on the success of RFAB1, the company’s first 300-millimeter analog fab, which opened in 2011.

TI is ramping LFAB1, the company’s first 300-millimeter wafer fab in Lehi, UT. Construction is also well underway on LFAB2, TI’s second Lehi fab, which will connect to LFAB1.