LEHI, UT—Texas Instruments Inc. will build its next 300-millimeter semiconductor wafer fabrication plant here. 

The new fab will be located next to the company’s existing 300-millimeter semiconductor wafer fab in Lehi. Once completed, TI’s two Lehi fabs will operate as a single factory.

“This new fab is part of our long-term, 300-millimeter manufacturing roadmap to build the capacity our customers will need for decades to come,” says Haviv Ilan, TI executive vice president and chief operating officer, and incoming president and chief executive officer. “Our decision to build a second fab in Lehi underscores our commitment to Utah and is a testament to the talented team there who will lay the groundwork for another important chapter in TI’s future. With the anticipated growth of semiconductors in electronics, particularly in industrial and automotive, and the passage of the CHIPS and Science Act, there is no better time to further invest in our internal manufacturing capacity.”

The $11 billion project marks the largest economic investment in Utah history. The Lehi expansion will create approximately 800 additional TI jobs as well as thousands of indirect jobs. TI will also invest $9 million in the local school district to improve student opportunities and outcomes.

The new factory will manufacture tens of millions of analog and embedded processing chips daily that will go into electronics everywhere.

The fab will be designed to meet the highest levels of structural efficiency and sustainability according to Leadership in Energy and Environmental Design (LEED) standards. Plans include recycling water at nearly double the rate of the existing Lehi fab. Advanced equipment and processes in Lehi will further reduce waste, water and energy consumption per chip.

Construction of the new fab is expected to begin in the second half of 2023, with production beginning as early as 2026. 

TI is also building four new 300-millimeter wafer fabs in Sherman, TX.