Electronics Assembly

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OULU, Finland—JOT Automation Inc. and EID Robotics have introduced a system of standardized, modular, robotic cells that can be combined to create microfactories for localized automated manufacturing of products.

An innovative 3D printing method streamlines multimaterial manufacturing.

AUBURN, MA—PI’s new N-332 nanometer-precision linear stage family is designed for high-end applications in semiconductors, fiber-optics, microscopy, nanobiotechnology, metrology, and research on beamlines and lasers. 

EC-1015HP epoxy potting compound provides significantly better crack resistance than traditional rigid epoxies.

DELO Dualbond EG6290 is a new sealant for CMOS image sensors, which are often used in driver monitoring systems.

Henkel has introduced three new potting compounds to protect automotive components from moisture and fluid ingress.

GREENVILLE, NC—Vietnamese solar manufacturer Boviet Solar will invest $294 million to build its first North American assembly plant here.

BROMONT, QC—IBM, Canada and Quebec will invest 187 million Canadian dollars ($139.6 million) to expand assembly, testing and packaging capabilities at the company’s semiconductor manufacturing facility here.

Having a larger, well-staffed U.S. manufacturing industry will provide a comprehensive framework to manage risk and support our national defense.

Multimedia Editor and Host Jennifer Pierce shares highlights from the ASSEMBLY Audible podcast.